Lei Huang

Lei Huang headshot photo.

Research Interests

Non-uniform ocean warming and sea level rise

 Water mass spread

Deep ocean variability

Lei Huang, PhD.

Postdoctoral Associate (University of Miami/CIMAS), Physical Oceanography Division 

302.510.2481 

4301 Rickenbacker Causeway
Miami, Florida 33149

“The combination of thermal expansion and ice melt due to ocean warming is causing sea levels to rise at an accelerating rate. This has significant implications for coastal communities, ecosystems, and infrastructure. Addressing sea level rise and ocean warming requires global efforts to mitigate climate change by reducing greenhouse gas emissions.”

Dr. Lei Huang joined AOML’s Physical Oceanography Division in September as a University of Miami-Cooperative Institute for Marine and Atmospheric Studies (CIMAS) post-doctoral scientist. Lei is working with Drs. Denis Volkov and Shenfu Dong on the accurate attribution of sea level variability along the US eastern seaboard using a suite of satellite and in situ observations, numerical ocean models, and oceanic and atmospheric reanalysis. He recently received a PhD from the University of Delaware.

Current Work

Sea level rise along the U.S. east coast.

Download Full CV

2023, Ph.D. Physical Oceanography, University of Delaware, Newark, DE

2023, Ph.D. Physical Oceanography, Xiamen University, Xiamen, Fujian, China

2016, M.Sc. Physical Oceanography, Guangdong Ocean University, Zhanjiang, Guangdong, China

2013, B.S. Oceanography, Nanjing University of Information, Science and Technology, Nanjing, China

Huang, L., Zhuang, W., Wu, Z., Zhang, Y., Meng, L., Edwing, D., & Yan, X. H. (2023). Quasi‐decadal Temperature Variability in the Intermediate Layer of Subtropical South Indian Ocean During the Argo Period. Journal of Geophysical Research: Oceans, e2023JC019775.

Huang, L., Zhuang, W., Wu, Z., Meng, L., Edwing, D., Edwing, K., … & Yan, X. H. (2022). Decadal Cooling Events in the South Indian Ocean during the Argo Era. Journal of Geophysical Research: Oceans, e2021JC017949.